The UVblade is a cost effective laser optical solution for laser lift-off applications at 308 nm. It consists of an excimer laser and an optical system transforming the laser beam into a line beam. A high throughput is possible for glass substrate generations up to Gen 8 because of common line lengths (250mm, 380mm, 465mm, 750mm).
Laser lift-off is the key technology in manufacturing flexible digital displays where thin-film transistor device structures are typically fabricated directly onto a polymer layer that has been spun on a glass substrate. UVblade selectively detaches the polymer based displays of all types from their rigid glass carriers. UVblade supports glass substrate generations up to Gen 8.
The UVblade is perfectly suited for the LLO application because of the following performances: single shot processing, short pulse length, high energy stability, UV wavelength 308nm, highest beam utilisation, homogeneous energy distribution, large area processing UV laser lift-off is the key technology in manufacturing two new upcoming technologies: On the one hand flexible displays, polymer-based display panels produced in either LCD, OLED or AMOLED technology. On the other hand temporal wafer debonding, for production of novel three-dimensional wafer-based electronic device structures.