VarioLas UV materials processing systems based on the COMPexPro 100 excimer laser series are affordable tools for high quality UV processing. Superior optics design, rugged mechanics and unmatched pulse-to-pulse stability are the key features of each VarioLas systems, which are available for the common excimer laser wavelengths 193nm, 248nm and 308nm.
VarioLas mask imaging systems ECO and PRO provide micromachining resolutions of 30µm and 5µm, respectively, at a field size of 2mm x 2mm and are ideal for machining all kinds of materials such as polymers, semiconductors, ceramics or glasses.
The VarioLas SWEEP supports scanned, large-area processing with 50mm x 0.6mm line beam for applications such as dopant activation of wafers and surface annealing. Each VarioLas version can be tailored to best suit the individual requirements. From a pure UV beam projection train providing a maximum degree of customisation to a fully automated Class 1 microprocessing workstation.