Webinar : Thermomechanical Integrity of Thin Films and Non-Interconnects

Webinar : Thermomechanical Integrity of Thin Films and Non-Interconnects

Date: Thursday 7 March 2024
Time: 3:30AM ACDT
 

If you are not a night owl, register, and you will receive copy of the recorded webinar after the event :)

An increasing number of material classes and complex geometries are found in integrated structures for semiconductor devices, elevating the importance of considering thermomechanical integrity to ensure optimal performance, reliability, and yield. Using nanoindentation-based characterisation methods is a valuable way to understand thermomechanical integrity.
 

During this free webinar, our guest speaker, Dr. Kris Vanstreels from imec, will discuss several nanoindentation based approaches will be demonstrated that can be used to study the thermomechanical integrity of thin films and nano-interconnects for semiconductor applications.
 

Webinar Presenter
Dr. Kris Vanstreelse
Researcher
Reliability and Modeling Group, imec

Featured Technologies:
Nanomechanical Test Systems
Nanomechanical Instruments for SEM/TEM
Nanomechanical Metrology Tools