Gatan Cross Section Kit

Ideal for preparing cross sectional transmission electron microscopy (XTEM) samples of semiconductor devices, thin films of various substrates, and composites

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Features:

Quickly and easily prepare XTEM samples for TEM study of interfaces with greater consistency
Used in conjunction with the ultrasonic cutter, cut rectangular areas of interest from bulk material to produce coated, stacked, and pressure-cured sections with minimum glue thickness (<1 µm)
Suitable for preparing cylinder sections for dimpling prior to ion milling