Gatan Dimple Grinder II

The Dimple Grinder II provides rapid material removal with minimal damage. Dimple grinding offers a fast and reliable mechanical method of pre-thinning to near electron transparency (in some cases to electron transparency) greatly reducing ion milling times and uneven thinning.

Features:

• Large transparent areas: Utilises both the large wheel and flat wheel to preserve a large transparent area after processing

• Stronger specimens: Leaves a thick supporting rim to protect and strengthen the specimen after dimpling

• Direct preparation of TEM specimens: Produces a final thickness of <3 µm in dimpled specimens

• Accurate depth and thickness control: User-defined stop point and real-time display ensure you can produce the appropriate dimple depth and thickness

• Micro-positioning: Provides both orthogonal and intersect axes for more accurate positioning