Gatan Dimple Grinder II
Gatan Dimple Grinder II
Fast and reliable mechanical method of pre-thinning to near electron transparency to greatly reduce your ion milling times and uneven thinning
The Dimple Grinder II provides rapid material removal with minimal damage. Dimple grinding offers a fast and reliable mechanical method of pre-thinning to near electron transparency (in some cases to electron transparency) greatly reducing ion milling times and uneven thinning.
Features:
- Large transparent areas: Utilises both the large wheel and flat wheel to preserve a large transparent area after processing
- Stronger specimens: Leaves a thick supporting rim to protect and strengthen the specimen after dimpling
- Direct preparation of TEM specimens: Produces a final thickness of <3 μm in dimpled specimens
- Accurate depth and thickness control: User-defined stop point and real-time display ensure you can produce the appropriate dimple depth and thickness
- Micro-positioning: Provides both orthogonal and intersect axes for more accurate positioning
For further information please contact us or download the datasheet.