AFM Probe Selection Webinar
Join us for a free virtual workshop on AFM probe selection on Wednesday 27 October 2021. During this workshop Mickael Febvre and Alexander Dulebo will explain the fundamentals of AFM probe design, provide an overview of the probes available and their properties, and outline how to select the right probe for the right application. There will also be a short presentation on the latest innovations in probe development for biological and materials sciences applications.
Meet the Bruker Team
Dr Mickael Febvre, Application Manager
Dr Alexander Dulebo, Application Scientist
Thin Film Measurement Webinar Series
As thin film technology advances, there is ever increasing demand in decreasing the film thicknesses of products for modern industries, especially in the semiconductor, hard coating and display industries. This evolution poses different challenges in manufacturing technology; including understanding the intrinsic film mechanical properties and evaluating the relationship between thin film mechanical properties and product quality. Nanoindentation and Scratch testing have thus become the most widely used techniques to meet these challenges.
Bruker understands your needs and challenges in Thin Film and ultra-thin film measurements. We are pleased to present this 4-part webinar series, where we will share about the nanomechanical technology relevant in thin films for research and industrial applications along with case studies.
Webinar 1: 1pm Thursday 12 August AEST Register
Challenges in Thin Film Hardness, Modulus Measurement Solutions
Webinar 2: 1pm Thursday 26 August AEST Register
Thin Film Interface Adhesion Characterisation for Industrial Applications
Webinar 3: 1pm Thursday 9 September AEST Register
Industrial Solutions of Measuring Thin Film Fracture Toughness
Webinar 4: 1pm Thursday 23 September AEST Register
Importance of Thin Film Mechancial Properties under Environmental Controls
If you have any questions at all, please contact us. We hope to see you at the webinar !Read More
In-Situ Nanomechanical Testing Mini Symposium
Tuesday and Wednesday 1 & 2 June 2021, 8:30pm AEST
Probing the mechanical behaviour of materials at the nanoscale is necessary for the development of new nanostructured materials and continued miniaturization of engineering devices, electronic components, thin films, and surface coatings. This symposium will cover state of the art topics related to cutting edge developments in nanoscale mechanical characterization of materials such as metals, alloys, ceramics and organic crystals. The talks will demonstrate in-situ nano-mechanical testing techniques to extract site specific properties across temperatures and environments in a high throughput manner as well as introduce data science approaches for the same. The lecture themes are relevant to both audiences from academia and industry.Read More
Advanced In-Situ Nanomechanical Test Instrument
Bruker Nanosurfaces has announced the release of the Hysitron PI 89 SEM PicoIndenter, which provides nanomechanical testing capabilities inside a scanning electron miroscopy (SEM) at higher loads and in more extreme environments than previously possible. This will benefit researchers' understanding of the deformation mechanisms of high-strength materials.
The PI 89 SEM Picoindenter is the first in-situ instrument with two rotation and tllt stage configuations. This enables flexible sample positioning toward the electron column for top-dwn imaging, tilting toward the FIB column for milling, spindle rotation for crystallographic alignment, and compatibiltiy with a wide range of detectors to enable structure-property correlation of complex materials.
Benchtop 3D Optical Profilometers
Bruker has released the next-generation benchtop ContourX 3D Optical Profilometers. The white light interferometry (WLI) platform features Bruker's new USI mode - a universal scanning mode that automatically determines the optimal measurement parameters for best metrology restuls. Additionally, a 5MP camera and new stage design significantly boosts large-area stitching, allowing for the collection of 1000 high-resolution stitched fields. This combination of features and capabilities enables greater convenience and productivity in a host of demanding research and industrial aplications ranging from studying novel material structures and characterising manufactured components for medical, automotive and aerospace.